Bone conduction microphone, bone conduction headset, and communication device

ABSTRACT

A bone conduction microphone is configured to convert vocal cord vibration into a sound signal. The bone conduction microphone includes a vibration collection unit configured to come into contact with a human body and collect vibration in a predetermined direction, which is included in the vocal cord vibration, and a switch configured to switch whether collection of the vibration in the predetermined direction is enabled. The switch is disposed on a side of the vibration collection unit, which is opposite to a side configured to come into contact with the human body, to allow a direction of an operation of switching whether collection of the vibration in the predetermined direction is enabled to be parallel to the predetermined direction.

TECHNICAL FIELD

The present disclosure relates to a bone conduction microphoneconfigured to come into contact with a human body and collect vocal cordvibration, as well as a bone conduction headset and a communicationdevice including the bone conduction microphone.

BACKGROUND ART

PTL 1 discloses a bone conduction microphone configured to be attachedfor use to a helmet, for example. The bone conduction microphonedisclosed in PTL 1 includes a sound receiving plate provided on an outerwall surface of a housing of the bone conduction microphone, and aswitch provided on another outer wall surface different from the outerwall surface provided with the sound receiving plate. When the boneconduction microphone is used to collect vocal cord vibration, a userhas to press the sound receiving plate onto his or her chin or throat,as well as to separately press the switch.

CITATION LIST Patent Literature

PTL 1: Unexamined Japanese Patent Publication No. 6-54387

SUMMARY OF THE INVENTION

The present disclosure provides a bone conduction microphone and otherdevices effective for collecting vocal cord vibration.

A bone conduction microphone according to the present disclosure is abone conduction microphone configured to convert vocal cord vibrationinto a sound signal, and includes a vibration collection unit configuredto come into contact with a human body and collect vibration in apredetermined direction, which is included in the vocal cord vibration,and a switch configured to switch whether collection of the vibration inthe predetermined direction is enabled. The switch is disposed on a sideof the vibration collection unit, which is opposite to a side configuredto come into contact with the human body, to allow a direction of anoperation of switching whether collection of the vibration in thepredetermined direction is enabled to be parallel to the predetermineddirection.

The bone conduction microphone according to the present disclosure cancollect vocal cord vibration through a simple operation performed by auser, and is effective for collecting vocal cord vibration.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a perspective view illustrating a communication deviceincluding a bone conduction headset according to a first exemplaryembodiment.

FIG. 2 is a perspective view illustrating an aspect of use of the boneconduction headset including a bone conduction microphone, according tothe first exemplary embodiment.

FIG. 3 is a cross-sectional perspective view of the bone conductionmicrophone according to the first exemplary embodiment.

FIG. 4 is cross-sectional views of the bone conduction microphoneaccording to the first exemplary embodiment, including a viewillustrating a switch off state and a view illustrating a switch onstate.

FIG. 5 is a block diagram illustrating a control configuration of thecommunication device according to the first exemplary embodiment.

FIG. 6 is a perspective view illustrating a communication deviceincluding a bone conduction headset according to a second exemplaryembodiment.

FIG. 7 is a perspective view of the bone conduction headset in FIG. 6,when viewed differently in angle from FIG. 6.

FIG. 8 is a perspective view illustrating an aspect of use of the boneconduction headset according to the second exemplary embodiment.

FIG. 9 is a view illustrating a speaker circuit of the bone conductionheadset according to the second exemplary embodiment.

FIG. 10 is a block diagram illustrating a control configuration of thecommunication device according to the second exemplary embodiment.

FIG. 11 is circuit diagrams relating to modification example 1 to thesecond exemplary embodiment, including a circuit diagram of a headsetmain body, a circuit diagram of a bone conduction microphone, and acircuit diagram of a sound microphone.

FIG. 12 is circuit diagrams relating to modification example 2 to thesecond exemplary embodiment, including a circuit diagram of a headsetmain body, a circuit diagram of a bone conduction microphone, and acircuit diagram of a sound microphone.

FIG. 13 is circuit diagrams relating to modification example 3 to thesecond exemplary embodiment, including a circuit diagram of a headsetmain body, a circuit diagram of a bone conduction microphone, and acircuit diagram of a sound microphone.

FIG. 14 is circuit diagrams relating to modification example 4 to thesecond exemplary embodiment, including a circuit diagram of a headsetmain body, a circuit diagram of a bone conduction microphone, and acircuit diagram of a sound microphone.

FIG. 15A is views relating to modification example 4 to the secondexemplary embodiment for describing an operation when the headset mainbody is coupled with the sound microphone and a type A transceiver.

FIG. 15B is views relating to modification example 4 to the secondexemplary embodiment for describing an operation when the headset mainbody is coupled with the bone conduction microphone and a type Atransceiver.

FIG. 15C is views relating to modification example 4 to the secondexemplary embodiment for describing an operation when the headset mainbody is coupled with the sound microphone and a type B transceiver.

FIG. 15D is views relating to modification example 4 to the secondexemplary embodiment for describing an operation when the headset mainbody is coupled with the bone conduction microphone and a type Btransceiver.

FIG. 15E is views relating to modification example 4 to the secondexemplary embodiment for describing an operation when the headset mainbody is coupled with the sound microphone and a smartphone typetransceiver.

FIG. 15F is views relating to the modification example 4 to the secondexemplary embodiment for describing an operation when the headset mainbody is coupled with the bone conduction microphone and a smartphonetype transceiver.

DESCRIPTION OF EMBODIMENTS

A bone conduction microphone according to the present disclosure isused, in a noise environment such as a construction site, to makecommunications, through wireless communications, with a partner in aremote location, for example. The bone conduction microphone is used bypressing a part of the bone conduction microphone onto a chin or athroat, for example, to collect, through bone conduction, vocal cordvibration generated from a human body.

Hereinafter, exemplary embodiments will be described in detail withreference to the drawings as appropriate. However, an excessivelydetailed description will not be given in some cases. For example,detailed descriptions of known matters and duplicated descriptions ofsubstantially the same configurations will be sometimes skipped. This isto avoid the following description from being unnecessarily redundantand thus to help those skilled in the art to easily understand thedescription.

The accompanying drawings and the following description are onlypresented to help those skilled in the art fully understand the presentdisclosure. It is therefore not intended that subject matters describedin the scope of the appended claims be limited to the drawings and thedescription herein.

First Exemplary Embodiment

Hereinafter, a first exemplary embodiment will be described withreference to FIGS. 1 to 5.

1-1. Overall Configuration of Communication Device

FIG. 1 is a perspective view illustrating communication device 9including bone conduction headset 5, according to the first exemplaryembodiment. FIG. 2 is a view illustrating an aspect of use of boneconduction headset 5 including bone conduction microphone 1.

As illustrated in FIG. 1, communication device 9 includes boneconduction headset 5 including bone conduction microphone 1 and headsetmain body 50, and transceiver 7. Bone conduction microphone 1 is coupledto headset main body 50 via microphone cable 4. Headset main body 50includes ear hooks 52. Ear hooks 52 are to be hooked to ears of a humanbody. Headset main body 50 is thus worn on a head. Headset main body 50is coupled to transceiver 7 via headset cable 6. Transceiver 7 isattached to a part of a garment, and is configured to performcommunications with an external device possessed by a communicationpartner, for example. Bone conduction microphone 1 may be coupled tocontroller 55 of headset main body 50, or may not be coupled tocontroller 55, but may be coupled to transceiver 7 to directly enter asignal into transceiver 7.

As illustrated in FIG. 2, bone conduction microphone 1 is attached tochin strap 3 of helmet 2 with metal fixture 26. Bone conductionmicrophone 1 includes vibration collection unit 10 configured to comeinto contact with the human body and collect vocal cord vibration, andhousing 21 configured to support vibration collection unit 10. To entervoice into bone conduction microphone 1, a user grips bone conductionmicrophone 1 and allows vibration collection unit 10 to come intocontact with a chin or a throat. Therefore, bone conduction microphone 1collects vocal cord vibration. When the user does not enter voice, boneconduction microphone 1 is suspended by chin strap 3. At this time,vibration collection unit 10 is detached from the chin or the throat ata predetermined distance and therefore would be less likely to come intocontact with the human body.

Bone conduction headset 5 includes sound microphone 57 configured tocollect sound via air, and microphone holder 58 configured to supportsound microphone 57. For example, bone conduction microphone 1 is to beused under a noise environment, whereas sound microphone 57 is to beused under a non-noise environment. Bone conduction microphone 1 andsound microphone 57 are selectively switched and used.

In FIG. 1, an illustration of sound microphone 57 is omitted. In FIG. 2,an illustration of microphone cable 4 is omitted.

1-2. Configuration of Bone Conduction Microphone

FIG. 3 is a cross-sectional perspective view of bone conductionmicrophone 1. FIG. 4 is cross-sectional views of bone conductionmicrophone 1. Part (a) illustrates a switch off state. Part (b)illustrates a switch on state.

As illustrated in FIGS. 3 and 4, bone conduction microphone 1 includesvibration collection unit 10 configured to collect vocal cord vibration,housing 21 configured to support vibration collection unit 10, andswitch 25 configured to switch whether collection of vocal cordvibration by vibration collection unit 10 is enabled.

First, vibration collection unit 10 will be described. Vibrationcollection unit 10 includes contact member 12 configured to come intocontact with the human body, vocal cord sensor 11 supported by contactmember 12, and pressing member 13 configured to transmit a pressingforce from contact member 12 to switch 25.

Contact member 12 is a member configured to come into contact with thehuman body to transmit vocal cord vibration being collected to vocalcord sensor 11. Contact member 12 has a bottomed cylindrical shape, andincludes side surface part 12 b, opening part 12 c opening at an end ofside surface part 12 b, and contact part 12 a provided at the other endof side surface part 12 b to come into contact with the human body. InFIG. 3, contact part 12 a is provided to face a positive side in a Zdirection of side surface part 12 b, while opening part 12 c is providedto face a negative side in the Z direction of side surface part 12 b.Side surface part 12 b is partially curved outward to have a structureconfigured to bend and deform to easily absorb vibration noise.

Contact member 12 is an elastic body softer than housing 21, and is madeof a resin material such as silicone rubber. A term “soft” denotes botha case in which a material being used is soft and a case in which astructure is soft (e.g., thin or wavy for easy deformation). It ispreferable that contact member 12 be made of such a material thatprovides a comfortable touch feel.

Vocal cord sensor 11 is a detection element configured to detectvibration in a predetermined direction (Z direction), which is includedin vocal cord vibration transmitted via contact member 12. Vocal cordsensor 11 is a piezoelectric element having a flat plate shape andconfigured to allow thickness vibration to occur, for example. Vocalcord sensor 11 is attached to an inner wall of contact part 12 a ofcontact member 12 to be able to deform in the Z direction to allowthickness vibration to occur. Vocal cord sensor 11 is configured toconvert vibration detected in the Z direction into an electric signal,and to enter the electric signal into headset main body 50 ortransceiver 7. In FIG. 3, an illustration of wire related to vocal cordsensor 11 is omitted. However, a sensor amplifier for vocal cord sensor11 may be provided in housing 21. The sensor amplifier may be used toamplify an electric signal. The signal may be entered into headset mainbody 50 or transceiver 7.

Pressing member 13 has a plate shape, and provided on the end of sidesurface part 12 b to cover opening part 12 c of contact member 12.Pressing member 13 is made of a resin material or a metal materialharder than contact member 12. Below a center of pressing member 13(adjacent to housing 21), switch 25 described above is disposed. Withpressing member 13 made of a material harder than contact member 12, apressing force received by contact member 12 when a user comes intocontact with contact member 12 can be securely transmitted to switch 25.

Pressing member 13 is provided with diaphragm 30 having an annularshape. Specifically, an outer circumference region on a lower surface(surface adjacent to housing 21) of pressing member 13 is adhered withan inner circumference region of upper surface 30 b of diaphragm 30.Diaphragm 30 is an elastic body softer than contact member 12, and caneasily absorb vibration noise. Diaphragm 30 can more easily deform thancontact member 12. A term “easily deform” denotes both a case in which amaterial that can easily deform is used and a case in which a structurethat can easily deform is used. For example, diaphragm 30 may be madefrom resin film (e.g., polyethylene terephthalate film) or metal filmhaving a thin plate shape to be able to easily deform. Diaphragm 30 madefrom an elastic body softer than contact member 12 for easy deformationprevents, when contact member 12 receives a pressing force, contactmember 12 from being crushed before pressing member 13 presses and turnson switch 25.

Next, housing 21 and switch 25 will be described. Housing 21 is made ofa resin material harder than contact member 12. Housing 21 has acylindrical shape, and includes base 21 a provided at an end of thecylindrical shape, and pillar 21 b having an annular shape protrudingtoward the other end from base 21 a around an outer circumference ofbase 21 a. Below (opposite to pillar 21 b) base 21 a, metal fixture 26described above is provided.

Cover 22 having a cylindrical shape is attached above housing 21. Cover22 has opening 22 a greater than contact member 12. With contact part 12a of contact member 12 being protruded and exposed from opening 22 a,base 21 a and pillar 21 b of housing 21 are covered with cover 22. Apredetermined gap is provided between opening 22 a of cover 22 and sidesurface part 12 b of contact member 12, suppressing cover 22 and contactmember 12 to come into contact with each other.

On end face 21 c of pillar 21 b of housing 21, diaphragm 30 andvibration collection unit 10 described above are disposed. Diaphragm 30is disposed to allow an outer circumference region of lower surface 30 ato overlap with end face 21 c of pillar 21 b. On an outer circumferenceregion of upper surface 30 b of diaphragm 30, packing 23 made ofsynthetic rubber and having an annular shape is disposed. As cover 22 isto be attached to housing 21, packing 23 presses diaphragm 30 againstpillar 21 b. Therefore, the outer circumference region of diaphragm 30is pinched by packing 23 and pillar 21 b.

In other words, diaphragm 30 is positioned between vibration collectionunit 10 and housing 21. Vibration collection unit 10 is supported byhousing 21 via diaphragm 30. With diaphragm 30 being deformed, vibrationcollection unit 10 is supported by housing 21 to allow positiondisplacement to occur in the Z direction.

Housing 21 includes switch fixing part 21 d configured to attach switch25. Switch fixing part 21 d protrudes from base 21 a, and is providedinside pillar 21 b.

Switch 25 is provided on switch fixing part 21 d. Switch 25 is disposedto allow an on-off operation direction to be parallel to the Zdirection, i.e., to be parallel to a direction of vibration to bedetected by vocal cord sensor 11.

More specifically, switch 25 is disposed on switch fixing part 21 d toallow a central axis extending in the Z direction of switch 25 and acentral axis extending in the Z direction of vibration collection unit10 to align with each other. Therefore, a pressing force applied ontovibration collection unit 10 can efficiently transmit to switch 25,improving ease of operation for a user.

Switch 25 is a tactile switch, for example. Switch 25 is kept an onstate while being pressed, and an off state when released. The tactileswitch includes a spring for easy absorption of vibration noise. Strokes1 in the Z direction of operation unit 25 a configured to performswitching between on and off is 0.2 mm, for example (see part (b) ofFIG. 4). Operation unit 25 a of switch 25 is provided to have, whileswitched off, a gap ranging from 0.1 mm to 0.2 mm inclusive with respectto pressing member 13. The gap may not always be provided. The lowersurface of pressing member 13 may be configured to come into contactwith operation unit 25 a of switch 25.

In bone conduction microphone 1 according to the exemplary embodiment,switch 25 is disposed, as illustrated in part (a) of FIG. 4, in housing21 in a direction of position displacement (negative side in the Zdirection) of vibration collection unit 10. As illustrated in part (b)of FIG. 4, when position displacement occurs on vibration collectionunit 10, vibration collection unit 10 presses switch 25. As a result,switch 25 is turned on. As switch 25 is turned on, vocal cord sensor 11of vibration collection unit 10 can collect vocal cord vibration.

A description based on an operation by the user will be given. As theuser grips bone conduction microphone 1, allows vibration collectionunit 10 to come into contact with the chin or the throat, and gentlypresses vibration collection unit 10 onto the chin or the throat, switch25 is turned on. As the user moves vibration collection unit 10 awayfrom the chin or the throat, switch 25 is turned off.

1-3. Configuration of Bone Conduction Headset

Next, a configuration of bone conduction headset 5 will be describedwith reference to FIG. 1.

Bone conduction headset 5 includes bone conduction microphone 1 andheadset main body 50.

Headset main body 50 includes support body 54 and a pair of speakers 51.Support body 54 has a U-shape, and includes both ends (end 54 b, end 54c) facing each other, and central part 54 a positioned between both theends (end 54 b, end 54 c). Central part 54 a of support body 54 denotesa part around a center when support body 54 is viewed along the U-shape.The pair of speakers 51 are respectively supported by both the ends (end54 b, end 54 c) to face each other. On one of the ends of support body54, i.e., end 54 b, bone conduction microphone 1 is coupled viamicrophone cable 4. As illustrated in FIG. 2, on the one of the ends,i.e., end 54 b, sound microphone 57 is also coupled via microphoneholder 58.

Support body 54 is mainly made of a resin material, and is internallyprovided with a wire aggregate having elasticity. Support body 54 isinternally provided with wires used to couple bone conduction microphone1, sound microphone 57, controller 55, and speakers 51, for example.Both the ends (end 54 b, end 54 c) of support body 54 each have a pillarshape extending upward and downward (Z direction). The pair of speakers51 are respectively provided on upper sides (positive side in the Zdirection) of both the ends (end 54 b, end 54 c). Both the ends (end 54b, end 54 c) are respectively provided with ear hooks 52. At centralpart 54 a of support body 54, controller 55 is incorporated.

FIG. 5 is a block diagram illustrating a control configuration ofcommunication device 9 including bone conduction headset 5.

As illustrated in FIG. 5, communication device 9 includes boneconduction headset 5 and transceiver 7.

Headset main body 50 includes controller 55 and speakers 51. Controller55 includes a central processing unit (CPU), a random access memory(RAM), and a read only memory (ROM), for example. Speakers 51 are boneconduction speakers, for example, and are coupled to controller 55. Boneconduction microphone 1 including vocal cord sensor 11 and switch 25 iscoupled to controller 55. Sound microphone 57 is coupled to controller55. Controller 55 of headset main body 50 is coupled to transceiver 7.

Communication device 9 is configured to perform wireless communications,via transceiver 7, with an external device possessed by a communicationpartner. Specifically, signals output from vocal cord sensor 11 andsound microphone 57 enter, via headset main body 50, into transceiver 7.The signals are further sent, via transceiver 7, to the external devicepossessed by the communication partner. However, while switch 25 of boneconduction microphone 1 is turned on, signals sent from sound microphone57 do not undergo processing, but only signals sent from vocal cordsensor 11 undergo processing in transceiver 7. On the other hand,transceiver 7 receives signals sent from the external device. Speakers51 then output the signals via controller 55 of headset main body 50. Ina communication method for transceiver 7, a frequency band such as 422MHz band or 440 MHz band is used.

A signal output from bone conduction microphone 1 may not once enterinto controller 55 of headset main body 50, but may directly enter intotransceiver 7. In the exemplary embodiment, bone conduction microphone1, headset main body 50, and transceiver 7 are wire-coupled with eachother. However the present disclosure is not limited to the example. Thecomponents may be wireless-coupled by using a frequency band such as 2.4GHz band used in Bluetooth (registered trademark), for example.

1-4. Effects and Other Benefits

As described above, in the exemplary embodiment, bone conductionmicrophone 1 configured to convert vocal cord vibration into a soundsignal includes vibration collection unit 10 configured to come intocontact with a human body and collect vibration in the predetermineddirection (Z direction in FIGS. 1 to 3), which is included in the vocalcord vibration, and switch 25 configured to switch whether collection ofvibration in the predetermined direction is enabled. Switch 25 isdisposed on a side of the vibration collection unit, which is oppositeto a side configured to come into contact with the human body, to allowthe direction of the operation of switching whether collection of thevibration in the predetermined direction is enabled to be parallel tothe predetermined direction.

Therefore, when switch 25 is operated in the predetermined direction,vibration collection unit 10 can easily collect vocal cord vibration inthe predetermined direction. Therefore, bone conduction microphone 1 caneasily collect vocal cord vibration with a simple operation.

In the exemplary embodiment, when vibration collection unit 10 ispressed onto a human body, switch 25 of bone conduction microphone 1 isturned on. When vibration collection unit 10 is detached from the humanbody, switch 25 is turned off. When switch 25 is in an on state,vibration collection unit 10 collects vibration in the predetermineddirection. When switch 25 is in an off state, vibration collection unit10 does not collect vibration in the predetermined direction.

Therefore, as vibration collection unit 10 is pressed onto or detachedfrom a human body, switch 25 switches whether collection of vocal cordvibration is enabled. Therefore, bone conduction microphone 1 can easilycollect vocal cord vibration with a simple operation. In particular, thebone conduction microphone is supposed to be used during work under anoise environment such as building site, construction site, factory, anddistribution warehouse. Bone conduction microphone 1 according to theexemplary embodiment can collect vocal cord vibration with a simpleoperation. Therefore, bone conduction microphone 1 does not hinder theuser at work, achieving higher ease of operation.

In the exemplary embodiment, vibration collection unit 10 includescontact member 12 configured to come into contact with a human body, andvocal cord sensor 11 configured to detect vibration in the predetermineddirection via contact member 12. Bone conduction microphone 1 furtherincludes housing 21 configured to support contact member 12 and switch25. Contact member 12 is an elastic body softer than housing 21.

Vocal cord sensor 11 is supported by housing 21 via contact member 12that is soft. Therefore, vocal cord sensor 11 would be less likely toaccept external vibration noise transmitted to housing 21 and vibrationnoise generated in housing 21. Therefore, bone conduction microphone 1can easily collect vocal cord vibration.

In the exemplary embodiment, bone conduction microphone 1 furtherincludes diaphragm 30 positioned between vibration collection unit 10and housing 21. Vibration collection unit 10 is supported by housing 21via diaphragm 30.

Vocal cord sensor 11 of vibration collection unit 10 is supported byhousing 21 via diaphragm 30. Therefore, vocal cord sensor 11 would beless likely to accept external vibration noise transmitted to housing 21and vibration noise generated in housing 21. Therefore, bone conductionmicrophone 1 can easily collect vocal cord vibration.

In the exemplary embodiment, diaphragm 30 is an elastic body softer thancontact member 12.

Therefore, external vibration noise transmitted to housing 21 andvibration noise generated in housing 21 are absorbed by soft diaphragm30, and would be less likely to enter into vocal cord sensor 11.Therefore, bone conduction microphone 1 can easily collect vocal cordvibration.

In the exemplary embodiment, housing 21 has a tubular shape.

Vibration collection unit 10 is supported by housing 21 via diaphragm 30to allow position displacement to occur in the operation direction ofswitch 25. Switch 25 is disposed in housing 21 in the direction ofposition displacement of vibration collection unit 10. When positiondisplacement occurs on vibration collection unit 10, vibrationcollection unit 10 presses switch 25. As a result, switch 25 is turnedon. Vibration collection unit 10 then collects vibration in thepredetermined direction (Z direction) described above.

Therefore, as switch 25 is operated in the predetermined direction,vibration collection unit 10 is ready to collect vocal cord vibration inthe predetermined direction. Therefore, bone conduction microphone 1 caneasily collect vocal cord vibration with a simple operation.

In the exemplary embodiment, vibration collection unit 10 and switch 25are disposed in housing 21 to allow the central axes extending in thedirection of position displacement (Z direction) to align with eachother.

Therefore, a pressing force applied onto vibration collection unit 10can efficiently transmit to switch 25, improving ease of operation for auser.

In the exemplary embodiment, vocal cord sensor 11 is a piezoelectricelement configured to provide thickness vibration. A thickness directionof the piezoelectric element is identical to the predetermined direction(Z direction) described above.

Therefore, vocal cord sensor 11 can easily collect vibration in thepredetermined direction, which is included in vocal cord vibration.

In the exemplary embodiment, bone conduction headset 5 includes boneconduction microphone 1 and speakers 51.

With bone conduction headset 5 equipped with bone conduction microphone1, bone conduction headset 5 can easily collect vocal cord vibrationwith a simple operation.

In the exemplary embodiment, communication device 9 includes boneconduction headset 5, and transceiver 7 coupled to bone conductionheadset 5 to perform communications with an external device.

With communication device 9 equipped with bone conduction headset 5described above, communication device 9 can easily collect vocal cordvibration with a simple operation, achieving easy communications.

In the exemplary embodiment, communication device 9 includes boneconduction microphone 1, and transceiver 7 coupled to bone conductionmicrophone 1 to perform communications with an external device.

With communication device 9 equipped with bone conduction microphone 1,communication device 9 can easily collect vocal cord vibration with asimple operation, achieving easy communications.

Second Exemplary Embodiment

Bone conduction headset 5A and communication device 9A according to asecond exemplary embodiment will be described below with reference toFIGS. 6 to 10.

2-1. Overall Configuration of Communication Device

FIG. 6 is a perspective view illustrating communication device 9Aincluding bone conduction headset 5A. FIG. 7 is a perspective view ofbone conduction headset 5A, when viewed differently in angle from FIG.6. FIG. 8 is a perspective view illustrating an aspect of use of boneconduction headset 5A.

As illustrated in FIGS. 6 and 7, communication device 9A includes boneconduction headset 5A including sound microphone 57 and headset mainbody 50, and transceiver 7. Sound microphone 57 is coupled to headsetmain body 50 via microphone holder 58. Headset main body 50 includes apair of speakers 51 and a pair of ear hooks 52. Ear hooks 52 are to behooked to ears of a human body. Headset main body 50 is thus worn on ahead. Speakers 51 are wire-coupled to transceiver 7 via headset cable 6.Transceiver 7 is attached to a part of a garment, and is configured toperform communications with an external device possessed by acommunication partner, for example. Sound microphone 57 may be coupledto controller 55 of headset main body 50 or may not be coupled tocontroller 55, but may be coupled to transceiver 7 to directly enter asignal into transceiver 7.

Bone conduction headset 5A includes bone conduction microphone 1configured to collect vocal cord vibration through bone conduction, andmicrophone cable 4 used to couple bone conduction microphone 1 toheadset main body 50. For example, bone conduction microphone 1 is to beused under a noise environment, whereas sound microphone 57 is to beused under a non-noise environment. Bone conduction microphone 1 andsound microphone 57 are selectively switched and used.

2-2. Configuration of Bone Conduction Headset

Bone conduction headset 5A includes sound microphone 57 configured tocollect sound via air, bone conduction microphone 1, and headset mainbody 50. A configuration of bone conduction microphone 1 is similar tothe configuration described in the first exemplary embodiment.Therefore, a detailed description is omitted.

Headset main body 50 includes support body 54 and a pair of speakers 51.Specifically, speakers 51 are bone conduction speakers configured totransmit sound information through bone conduction to a brain withoutdrum membranes being interposed. Support body 54 has a U-shape, andincludes both ends (end 54 b, end 54 c) facing each other, and centralpart 54 a positioned between both the ends (end 54 b, end 54 c). Centralpart 54 a of support body 54 denotes a part around a center when supportbody 54 is viewed along the U-shape. The pair of speakers 51 arerespectively supported by both the ends (end 54 b, end 54 c) to faceeach other.

On one end of support body 54, i.e., end 54 b, sound microphone 57 iscoupled via microphone holder 58, as well as bone conduction microphone1 is coupled via microphone cable 4. On the other end of support body54, i.e., end 54 c, transceiver 7 is coupled via headset cable 6. Aconnector may be used as coupler 59 configured to couple headset cable 6and end 54 c to allow headset cable 6 to be attached to and detachedfrom end 54 c.

Support body 54 is mainly made of a resin material, and is internallyprovided with a wire aggregate having elasticity. Support body 54 isinternally provided with wires used to couple sound microphone 57, boneconduction microphone 1, controller 55, and speakers 51, as well as PTTswitch 62 and mute switch 64 described later, for example. Both the ends(end 54 b, end 54 c) of support body 54 each have a pillar shapeextending upward and downward (Z direction). The pair of speakers 51 arerespectively provided on upper sides (positive side in the Z direction)of both the ends (end 54 b, end 54 c). Both the ends (end 54 b, end 54c) are respectively provided with ear hooks 52. At central part 54 a ofsupport body 54, controller 55 is incorporated.

Support body 54 has elasticity. Parts other than central part 54 a canthus easily deform. Specifically, support body 54 has a structureallowing the parts other than central part 54 a to deform to change adistance between both the ends (end 54 b, end 54 c) facing each other.An elastic force of support body 54 is adjusted to allow, when headsetmain body 50 is worn on the head, pressing force P1 to be appropriatelyapplied to sides of the head without allowing speakers 51 to detach fromskin on areas in front of the ears, as well as to press the skinexcessively. Support body 54 is formed, when headset main body 50 isworn, to extend from both the ends (end 54 b, end 54 c), through lowersides of the ears, to central part 54 a lying on a rear side of thehead. As the lower sides of the ears are bypassed, a pair of eyeglassescan be easily worn. With the form extending to central part 54 a lyingon the rear side of the head, a helmet or a cap can be easily worn.

Bone conduction headset 5A according to the exemplary embodimentincludes push to talk (PTT) switch 62 used to make communications with acommunication partner holding an external device, and mute switch 64used to lower sound entering from the external device.

PTT switch 62 is provided to end 54 b without being coupled with headsetcable 6. Specifically, PTT switch 62 is provided to outside surface 54 b1 of end 54 b. PTT switch 62 is turned on when a button is pressed in adirection vertical to outside surface 54 b 1, i.e., toward a left sidesurface of a face. When PTT switch 62 is turned on, the user can makecommunications with the communication partner. It is preferable that PTTswitch 62 be provided to face the positive side in the Z direction froma center of outside surface 54 b 1. Further, it is more preferable thatPTT switch 62 be provided on a rear surface of corresponding one ofspeakers 51. This prevents headset main body 50 from moving from thehead even when the user presses the button.

Mute switch 64 is provided to end 54 c coupled with headset cable 6. Inother words, mute switch 64 is provided to end 54 c opposite to end 54 bprovided with PTT switch 62. Mute switch 64 is inserted and coupled to awire that couples coupler 59 and speaker 51 on end 54 b, as well asinserted and coupled to a wire that couples coupler 59 and speaker 51 onend 54 c. Mute switch 64 according to the exemplary embodiment includesan operation unit (button) configured to accept an operation by a user,as well as includes a resistor and a contact (switch) provided in aspeaker circuit described later.

Mute switch 64 is provided to outside surface 54 c 1 of end 54 c. Muteswitch 64 operates when the button is pressed in a direction vertical tooutside surface 54 c 1, i.e., toward a right side surface of the face.Similar to PTT switch 62, it is preferable that mute switch 64 beprovided to face the positive side in the Z direction from a center ofoutside surface 54 c 1 to prevent the headset main body from moving fromthe head even when the button is pressed. It is more preferable thatmute switch 64 be provided to outside surface 54 c 1 of end 54 c, i.e.,on a rear surface of corresponding one of speakers 51. While mute switch64 is pressed, volume of sound signals from transceiver 7 lowers. Asmute switch 64 is released, volume of sound signals from transceiver 7returns to its original degree.

A pressing force required to operate mute switch 64 is set toapproximately ½ to ¼ inclusive of pressing force P1 that each of thesides of the head receives when headset main body 50 is worn (see FIG.8). That is, with the set force smaller than pressing force P1, headsetmain body 50 is prevented from moving from the head even when muteswitch 64 is pressed.

FIG. 9 is a circuit diagram illustrating the speaker circuit of boneconduction headset 5A according to the second exemplary embodiment.

In the speaker circuit according to the exemplary embodiment, theresistor and mute switch 64 are bypass-inserted between a positive sidewire and a ground side wire for speakers 51. As the user presses thebutton of mute switch 64, the contact closes. Therefore, the resistor iscoupled to the speaker circuit, lowering a level of sound to be outputfrom speakers 51.

FIG. 10 is a block diagram illustrating a control configuration ofcommunication device 9A including bone conduction headset 5A.

As illustrated in FIG. 10, headset main body 50 includes controller 55and speakers 51. Controller 55 includes a central processing unit (CPU),a random access memory (RAM), and a read only memory (ROM), for example.Specifically, speakers 51 are bone conduction speakers, and are coupledto transceiver 7 via mute switch 64.

Sound microphone 57 and bone conduction microphone 1 are coupled tocontroller 55. PTT switch 62 is coupled to controller 55. Controller 55is coupled to transceiver 7 via signal line 71. Mute switch 64 isprovided on a signal line distinct from signal line 71, i.e., providedon sound line 72 configured to accept outputs from transceiver 7. Soundline 72 of headset main body 50 is coupled with input unit 73 configuredto accept sound signals from transceiver 7. Input unit 73 is provided toend 54 c, similar to mute switch 64. A sound signal entered into inputunit 73 enters into bone conduction speakers 51.

Communication device 9A performs wireless communications, viatransceiver 7, with an external device possessed by a communicationpartner. Specifically, signals output from sound microphone 57 and boneconduction microphone 1 enter transceiver 7 via headset main body 50.Further, the signals are sent, via transceiver 7, to the external devicepossessed by the communication partner. On the other hand, a signal sentfrom the external device is received by transceiver 7, and is thenanalog-converted. Further, the signal is output, via headset cable 6 andmute switch 64, from speakers 51. In a communication method fortransceiver 7, a frequency band such as 422 MHz band or 440 MHz band isused. Bone conduction headset 5A may perform communications with aplurality of external communication apparatuses via transceiver 7.

By pressing PTT switch 62, the user can make communications with thecommunication partner. The user can press mute switch 64 to lower soundfrom the communication partner.

2-3. Effects and Other Benefits

As described above, in the exemplary embodiment, bone conduction headset5A includes support body 54 having a U-shape, the pair of boneconduction speakers 51 respectively provided to one of ends of supportbody 54, i.e., first end 54 b, and another one of the ends, which liesopposite to first end 54 b, i.e., second end 54 c, sound microphone 57coupled to first end 54 b, and mute switch 64 provided to either offirst end 54 b or second end 54 c, and configured to control boneconduction speakers 51 to lower volume.

Therefore, a user can operate mute switch 64 provided to bone conductionheadset 5A to lower volume on bone conduction speakers 51. For example,while the user wearing bone conduction headset 5A is makingconversations with an adjacent partner, if the user hears othercommunications via bone conduction speakers 51 from transceiver 7, theuser faces difficulty in making conversations with the adjacent partner.In this case, the user can operate mute switch 64 to lower volume onbone conduction speakers 51 to continue smooth conversations.

In the exemplary embodiment, the pair of bone conduction speakers 51include the speaker circuit. Mute switch 64 includes the buttonconfigured to accept an operation by the user, the resistor configuredto be coupled with the speaker circuit, and the switch configured tocouple the resistor to the speaker circuit. When the button is operated,the switch closes. The resistor is coupled to the speaker circuit.Volume on bone conduction speakers 51 thus lowers.

As described above, bone conduction headset 5A can lower volume on boneconduction speakers 51 without fully silencing sound. If sound is fullysilenced, the user cannot respond to an instruction given from thecommunication partner to complete a task or cannot answer thecommunication partner. However, by lowering volume without fullysilencing sound, the user can respond to the communication partner asrequired.

In the exemplary embodiment, first end 54 b or second end 54 c is notprovided with mute switch 64, but is provided with PTT switch 62configured to switch on or off of an input of sound microphone 57.

PTT switch 62 and mute switch 64 are respectively provided to ends 54 b,54 c distinct from each other. Therefore, PTT switch 62 and mute switch64 would be less likely to be unintentionally pressed.

In the exemplary embodiment, bone conduction headset 5A includes coupler59 and headset cable 6 both used to couple transceiver 7, and isconfigured to perform communications with a plurality of externalcommunication apparatuses via transceiver 7.

Therefore, bone conduction headset 5A can perform communications withthe plurality of external communication apparatuses. In the situation,even when the user hears from transceiver 7 communications that are notdirected to the user, the user can operate mute switch 64 to lowervolume on bone conduction speakers 51. By lowering volume ofcommunications that are not directed to the user, the user can smoothlymake conversations with an adjacent partner, and, further, canconcentrate the user's task.

In the exemplary embodiment, bone conduction headset 5A includes supportbody 54 having a U-shape, speakers 51 respectively provided to one endof support body 54, i.e., end 54 b, and the other end, i.e., end 54 c,headset cable 6 for accepting sound from an external device, and muteswitch 64 configured to lower sound entering from the external device.Headset cable 6 and mute switch 64 are both provided to either of theends, i.e., end 54 b and end 54 c.

In the exemplary embodiment, second end 54 c includes input unit 73configured to accept a sound signal entering from transceiver 7. Muteswitch 64 is also provided to second end 54 c.

Therefore, wiring inside support body 54 can be simplified. If headsetcable 6 and input unit 73 are provided to end 54 b, and mute switch 64is provided to end 54 c, a wire in end 54 b coupled with headset cable 6and input unit 73 needs to be inserted into support body 54, and coupledto mute switch 64 on end 54 c. The wire then needs to be folded,inserted into support body 54, and coupled to speaker 51 on end 54 b. Inthe exemplary embodiment, headset cable 6, input unit 73, and muteswitch 64 are all provided to one of the ends of support body 54.Therefore, a wire does not need to be folded, shortening a wire length.Therefore, wiring inside bone conduction headset 5A can be simplified.

In the exemplary embodiment, a pressing force required to operate muteswitch 64 ranges from ½ to ¼ inclusive of pressing force P1 to beapplied to each of the sides of the head when headset main body 50 isworn.

Therefore, even when mute switch 64 is pressed, bone conduction headset5A can be easily prevented from moving from the head.

In the exemplary embodiment, the operation unit (button) of mute switch64 is disposed on outside surface 54 b 1 of first end 54 b or outsidesurface 54 c 1 of second end 54 c, in other words, on an upper sideabove the center of outside surface 54 b 1 or outside surface 54 c 1,i.e., disposed to face the positive side in the Z direction.

Therefore, even when mute switch 64 is pressed, bone conduction headset5A can be easily prevented from moving from the head.

2-4. Modification Examples

In the second exemplary embodiment, one of the ends of support body 54,i.e., end 54 b, is coupled with sound microphone 57 via microphoneholder 58, as well as is coupled with bone conduction microphone 1 viamicrophone cable 4.

Here is described, as modification examples to the second exemplaryembodiment, cases where bone conduction microphone 1 and soundmicrophone 57 are detachably and replaceably coupled to headset mainbody 50.

First, a coupler including connector 170 is provided to end 54 b ofheadset main body 50. Connector 180 is used at an end of microphonecable 4, which is to be coupled to bone conduction microphone 1, i.e.,to be coupled to headset main body 50. Connector 190 is used at an endof microphone holder 58 to be coupled to sound microphone 57, i.e., tobe coupled to bone conduction headset 5A. With this configuration, boneconduction microphone 1 and sound microphone 57 are detachable andreplaceable with respect to headset main body 50.

At this time, when the coupler at end 54 b is coupled with soundmicrophone 57, communications with a communication partner may bepossible when PTT switch 62 is in an on state. When the coupler at end54 b is coupled with bone conduction microphone 1, communications with acommunication partner may be possible when switch 25 is in an on state.

How to operate PTT switch 62 provided to headset main body 50 and switch25 provided to bone conduction microphone 1 will be described below withreference to FIGS. 11, 12.

FIG. 11 is circuit diagrams relating to modification example 1 to thesecond exemplary embodiment. Part (a) is a circuit diagram of headsetmain body 50. Part (b) is a circuit diagram of bone conductionmicrophone 1. Part (c) is a circuit diagram of sound microphone 57.

As illustrated in part (a) of FIG. 11, connector 170 of the coupler atend 54 b is a female stereo jack (three-polar jack). Chip 171 (Lch) ofconnector 170 is coupled to controller 55 via PTT switch 62. Ring 172(Rch) of connector 170 is directly coupled to controller 55. Sleeve 173(GND) of connector 170 is coupled to GND.

As illustrated in part (b) of FIG. 11, connector 180 of bone conductionmicrophone 1 is a male stereo jack (three-polar jack). A signal pickedby vocal cord sensor 11 is output from ring 182 (Rch) of connector 180.Switch 25 is inserted between vocal cord sensor 11 and ring 182 (Rch).The details on switch 25 have been described in the first exemplaryembodiment.

As illustrated in part (c) of FIG. 11, connector 190 of sound microphone57 is a male stereo jack (three-polar jack). A signal picked by soundmicrophone 57 is output from chip 191 (Lch) of connector 190.

With the configuration described above, when bone conduction microphone1 is coupled to headset main body 50, connector 180 is inserted intoconnector 170. Therefore, conversations can be controlled with switch 25provided to bone conduction microphone 1. On the other hand, whenheadset main body 50 is coupled to sound microphone 57, connector 190 isinserted into connector 170. Therefore, conversations can be controlledwith PTT switch 62 provided to end 54 b of bone conduction headset 5A.

FIG. 12 is circuit diagrams relating to modification example 2 to thesecond exemplary embodiment. Part (a) is a circuit diagram of headsetmain body 50. Part (b) is a circuit diagram of bone conductionmicrophone 1. Part (c) is a circuit diagram of sound microphone 57.

In the circuit diagram of modification example 1 described in FIG. 11,the stereo jack (three-polar jack) has been used as connector 190 ofsound microphone 57. However, monaural jacks (bipolar jacks) are oftenused in an ordinary sound microphone. If a monaural jack connector isused in the circuit diagram of modification example 1, ring 172 (Rch) ofconnector 170 reaches GND. Therefore, a current cannot sometimes flowinto chip 171 (Lch).

In view of this fact, modification example 2 will describe a circuitdiagram where sound microphone 57 has connector 195 that is a monauraljack.

The circuit illustrated in FIG. 12 differs in configuration from thecircuit illustrated in FIG. 11 in terms of two points described below.First, one of the two points is that connector 195 of sound microphone57 is a monaural jack (bipolar jack). Further, the other of the twopoints is that a circuit including transistor 174 and transistor 175 isprovided between ring 172 (Rch) of connector 170 of headset main body 50and controller 55.

How the circuit illustrated in FIG. 12 operates will be described below.

When connector 195 (monaural jack) of sound microphone 57 is insertedinto connector 170 of headset main body 50, ring 172 (Rch) of connector170 reaches GND. A base of transistor 174 reaches 0 V. A collector oftransistor 174 attains High. A gate of transistor 175 attains High.Transistor 175 is thus turned OFF. Therefore, no current flows into ring172 (Rch) of connector 170. However, when PTT switch 62 of headset mainbody 50 is turned on, a current flows into chip 171 (Lch) of connector170.

On the other hand, when connector 180 of bone conduction microphone 1 isinserted into connector 170 of headset main body 50, ring 172 (Rch) doesnot reach GND. Therefore, a voltage is applied to the base of transistor174. The base of transistor 174 attains High. An emitter of transistor174 attains Low. As a result, the collector of transistor 174 attainsLow. A gate of transistor 175 then attains Low. Transistor 175 is turnedON. As a result, a current flows into ring 172 (Rch) of connector 170.

Next, circuits will be described with reference to FIGS. 13, 14 in acase in which controller 55 of headset main body 50 sends soundcollected with a microphone to transceiver 7, and a case in whichcontroller 55 outputs the sound received from transceiver 7 to boneconduction speakers 51.

FIG. 13 is circuit diagrams relating to modification example 3 to thesecond exemplary embodiment. Part (a) is a circuit diagram of headsetmain body 50. Part (b) is a circuit diagram of bone conductionmicrophone 1. Part (c) is a circuit diagram of sound microphone 57.

In modification example 3 illustrated in FIG. 13, sound microphone 57and bone conduction microphone 1 are selectively coupled to connector220 of headset main body 50. Transceiver 7 is coupled to connector 200of headset main body 50. Connector 200 lies at a tip of headset cable 6.As an example, connector 220 to the microphone is a three-polar jack(female), while connector 200 to transceiver 7 is a four-pole plug(male). Here, it is supposed that transceiver 7 to be coupled to headsetmain body 50 is such a type of a transceiver (hereinafter referred to astype A transceiver) that is configured to detect that the PTT switch ispressed, through a voltage drop (e.g. from 3 V to 2 V) at sleeve 204 ofconnector 200.

As illustrated in part (a) of FIG. 13, chip 221 (Lch) of connector 220is coupled to sleeve 204 (Mic) of connector 200 via PTT switch 230. Ring222 (Rch) of connector 220 is coupled to sleeve 204 of connector 200.Sleeve 223 (GND) of connector 220 is coupled to ring 1_203 (GND) ofconnector 200. Ring 2_202 (sound−) and chip 201 (sound+) of connector200 are both coupled to speaker 211 (Lch) and speaker 212 (Rch).

The circuit diagram of the bone conduction microphone in part (b) ofFIG. 13 and the circuit of sound microphone 57 in part (c) of FIG. 13are respectively similar to the circuit diagrams in parts (b), (c) ofFIG. 11. Therefore, descriptions are omitted in here.

Next, operations when two kinds of microphones are each combined with atype A transceiver will be described.

Combination of Sound Microphone and Type A Transceiver

When sound microphone 57 is used in headset main body 50, PTT switch 230of headset main body 50 is used to achieve a PTT function. Sleeve 204 ofconnector 200 is coupled, via chip 221 of connector 220, chip 191 ofconnector 190, sound microphone 57, sleeve 193 of connector 190, andsleeve 223 of connector 220, to GND (ring 1_203 of connector 200).Therefore, when PTT switch 230 is pressed, a voltage drop occurs.Transceiver 7 detects the voltage drop at sleeve 204 of connector 200 todetect that PTT switch 230 is pressed.

Combination of Bone Conduction Microphone and Type A Transceiver

When bone conduction microphone 1 is used in headset main body 50,switch 25 of bone conduction microphone 1 is used to achieve a PTTfunction. Sleeve 204 of connector 200 is coupled, via ring 222 ofconnector 220, ring 182 of bone conduction microphone 1, switch 25,vocal cord sensor 11, sleeve 183 of bone conduction microphone 1, andsleeve 223 of connector 220, to GND (ring 1_203 of connector 200).Therefore, when switch 25 of bone conduction microphone 1 is pressed, avoltage drop occurs. Transceiver 7 detects the voltage drop at sleeve204 of connector 200 to detect that the PTT switch is pressed.

As described above, in modification example 3, transceiver 7 can detectthat PTT switch 230 is pressed, regardless of a kind of a microphone.

Next, modification example 4 to the second exemplary embodiment will bedescribed below with reference to FIGS. 14 and 15A to 15F. FIG. 14 iscircuit diagrams relating to modification example 4. Part (a) is acircuit diagram of headset main body 50. Part (b) is a circuit diagramof bone conduction microphone 1. Part (c) is a circuit diagram of soundmicrophone 57.

In modification example 4, sound microphone 57 and bone conductionmicrophone 1 illustrated in FIG. 14 are selectively coupled to connector320 of headset main body 50. Transceiver 7 is coupled to connector 300of headset main body 50. Connector 300 lies at a tip of headset cable 6.As an example, connector 320 to the microphone is a three-polar jack(female), while connector 300 to transceiver 7 is a four-pole plug(male).

In modification example 4, transceiver 7 to be coupled to headset mainbody 50 varies in kind. That is, three kinds of transceivers areavailable, such as type B transceiver and smartphone type transceiver,in addition to type A transceiver described above. A type B transceiverdenotes a type of a transceiver configured to detect the PTT switchthrough a voltage drop (e.g. from 3 V to 0 V) at ring 2_302 of connector300.

A smartphone type transceiver denotes a smartphone having a transceiverfunction configured to always turn a microphone on without detecting aPTT switch.

As illustrated in part (a) of FIG. 14, in headset main body 50, chip 321(Lch) of connector 320 on a microphone side is coupled, via ring 2_302of connector 300 on a transceiver side and PTT switch 340, to ring 1_303of connector 300. Ring 322 (Rch) of connector 320 is coupled to ring1_303 (GND) of connector 300. Sleeve 323 (GND) of connector 320 iscoupled to sleeve 304 (Mic) of connector 300. Ring 1_303 and chip 301 ofconnector 300 are both coupled to left speaker 331 and right speaker332.

As illustrated in part (b) of FIG. 14, connector 360 of bone conductionmicrophone 1 is a male stereo jack (three-polar jack). A signal pickedby vocal cord sensor 11 is output, via chip 361 (Lch) of connector 360and PTT switch 370, from ring 362 (Rch).

The circuit of the sound microphone in part (c) of FIG. 14 is similar tothe circuit of the sound microphone illustrated in part (c) of FIG. 11.Therefore, here omits its description.

Next, operations when two kinds of microphones and three kinds oftransceivers are respectively combined with each other will bedescribed.

Combination of Sound Microphone and Type A Transceiver

FIG. 15A is views for describing an operation when headset main body 50is coupled with sound microphone 57 and transceiver 7 that is a type Atransceiver.

When sound microphone 57 is used in headset main body 50, PTT switch 340of headset main body 50 illustrated in part (a) is used to achieve a PTTfunction. Sleeve 304 of connector 300 is coupled, via sleeve 323 ofconnector 320, sleeve 193 of sound microphone 57, chip 191 of soundmicrophone 57, and PTT switch 340, to GND 310. Therefore, when PTTswitch 340 is pressed, a voltage drop occurs. Transceiver 7 can detectthe voltage drop at sleeve 304 of connector 300 to detect that PTTswitch 340 is pressed. The configuration and the function of PTT switch340 are similar to the configuration and the function of mute switch 64in the second exemplary embodiment.

Combination of Bone Conduction Microphone and Type A Transceiver

FIG. 15B is views for describing an operation when headset main body 50is coupled with bone conduction microphone 1 and transceiver 7 that is atype A transceiver.

When bone conduction microphone 1 is used in headset main body 50, PTTswitch 370 of bone conduction microphone 1 illustrated in part (b) isused to achieve a PTT function. Sleeve 304 of connector 300 is coupled,via sleeve 323 of connector 320, sleeve 363 of bone conductionmicrophone 1, PTT switch 370, and ring 362 of bone conduction microphone1, to GND 310. Therefore, when PTT switch 370 of bone conductionmicrophone 1 is pressed, a voltage drop occurs. Transceiver 7 can detectthe voltage drop at sleeve 304 of connector 300 to detect that PTTswitch 370 is pressed. The configuration and the function of PTT switch370 are similar to the configuration and the function of switch 25 inthe first exemplary embodiment.

Combination of Sound Microphone and Type B Transceiver

FIG. 15C is views for describing an operation when headset main body 50is coupled with sound microphone 57 and transceiver 7 that is a type Btransceiver.

When sound microphone 57 is used in headset main body 50, PTT switch 340of headset main body 50 illustrated in part (a) is used to achieve a PTTfunction. While PTT switch 340 of headset main body 50 is not pressed, avoltage is supplied from transceiver 7 to sleeve 304 (Mic) of connector300. The voltage is further supplied, via sleeve 323 of connector 320,sound microphone 57, and chip 321 of connector 320, to ring 2_302 (PTTthrough) of connector 300. On the other hand, when PTT switch 340 ofheadset main body 50 is pressed, ring 2_302 of connector 300 is coupled,via PTT switch 340, to GND 310. As a result, a voltage drop occurs.Transceiver 7 can detect the voltage drop at ring 2_302 of connector 300to detect that the PTT switch is pressed.

Combination of Bone Conduction Microphone and Type B Transceiver

FIG. 15D is views for describing an operation when headset main body 50is coupled with bone conduction microphone 1 and transceiver 7 that is atype B transceiver.

When bone conduction microphone 1 is used in headset main body 50, PTTswitch 370 of bone conduction microphone 1 illustrated in part (b) isused to achieve a PTT function. While PTT switch 370 of bone conductionmicrophone 1 is not pressed, a voltage is supplied from transceiver 7 tosleeve 304 of connector 300. The voltage is further supplied, via sleeve323 of connector 320, sound microphone 57, and chip 321 of connector320, to ring 2_302 (PTT through) of connector 300. On the other hand,when PTT switch 370 of bone conduction microphone 1 is pressed, ring2_302 of connector 300 is coupled, via chip 361 of bone conductionmicrophone 1, PTT switch 370, and ring 362 of bone conduction microphone1, to GND 310. As a result, a voltage drop occurs. Transceiver 7 detectsthe voltage drop at ring 2_302 of connector 300 to detect that the PTTswitch is pressed.

Combination of Sound Microphone and Smartphone Type Transceiver

FIG. 15E is views for describing an operation when headset main body 50is coupled with sound microphone 57 and transceiver 7 that is asmartphone type transceiver.

To couple transceiver 7 that is a smartphone type transceiver to headsetmain body 50, a part (not illustrated) configured to short-circuit ring1_303 and ring 2_302 of connector 300 illustrated in part (a) is to beinserted between connector 300 and transceiver 7. Below will bedescribed an operation under a supposition that the part is inserted,and thus ring 1_303 and ring 2_302 of connector 300 are short-circuited.

Ring 2_302 of connector 300 is short-circuited with ring 1_303 ofconnector 300, and thus reaches GND. Chip 321 of connector 320 alsoreaches GND. At this time, chip 191 of connector 190 of sound microphone57 illustrated in part (b) also reaches GND. As a result, soundmicrophone 57 attains a normally operating state. Therefore, even when auser does not press PTT switch 340 of headset main body 50, the user canuse sound microphone 57 to make communications.

Combination of Bone Conduction Microphone and Smartphone TypeTransceiver

FIG. 15F is views for describing an operation when headset main body 50is coupled with bone conduction microphone 1 and transceiver 7 that is asmartphone type transceiver.

To couple a smartphone type transceiver to headset main body 50, a part(not illustrated) configured to short-circuit ring 1_303 and ring 2_302of connector 300 illustrated in part (a) is to be inserted betweenconnector 300 and transceiver 7. Herein will describe an operation undera supposition that the part is inserted, and thus ring 1_303 and ring2_302 of connector 300 are short-circuited.

Ring 2_302 of connector 300 is short-circuited with ring 1_303 ofconnector 300, and thus reaches GND. Chip 321 of connector 320 alsoreaches GND. At this time, chip 361 of connector 360 of bone conductionmicrophone 1 illustrated in part (b) also reaches GND. As a result, boneconduction microphone 1 attains a normally operating state. Therefore,even when a user does not press PTT switch 370 of bone conductionmicrophone 1, the user can use bone conduction microphone 1 to makecommunications.

As described above, headset main body 50 according to modificationexample 4 can operate in any of the combinations of the two kinds ofmicrophones and the three kinds of transceivers.

Effects and Other Benefits of Modification Example 4

As described above, modification example 4 is a bone conduction headsetsystem, i.e., a sound input and output device, including headset mainbody 50 and a microphone device. Headset main body 50 includes PTTswitch 340 serving as a communication switch, the bone conductionspeakers, connector 320 serving as a first connector to be coupled withthe microphone (1, 57), and connector 300 serving as a second connectorto be coupled with transceiver 7. Connector 320 includes the threecontacts of sleeve 323, ring 322, and chip 321 arranged in this order.Connector 300 includes the four contacts of sleeve 304, ring 1_303, ring2_302, and chip 301 arranged in this order. Sleeve 304 of connector 320is coupled to sleeve 323 of connector 300. Ring 322 of connector 320 iscoupled to a ground. Chip 321 of connector 320 is coupled to ring 2_302of connector 300, as well as is coupled, via PTT switch 340, to theground. The microphone device includes the microphone (1, 57), and theconnector (360, 190) serving as a third connector configured to couplethe microphone (1, 57) to headset main body 50. The connector (360, 190)includes the three contacts of the chip (361, 191), the ring (362), andthe sleeve (363, 193) arranged in this order. The sleeve (363, 193) ofthe connector (360, 190) is coupled to one of terminals of themicrophone (1, 57). The chip (361, 191) of the connector (360, 190) iscoupled to another one of the terminals of the microphone (1, 57). Theconnector (360, 190) is coupled to connector 320 of headset main body50.

Therefore, the bone conduction headset system can detect that PTT switch340 is pressed even when a transceiver coupled to connector 300 iseither of type A and type B.

In the bone conduction headset system according to modification example4, connector 320 is the three-polar jack including the three contacts ofsleeve 323, ring 322, and chip 321 arranged in this order from a pluginsertion port. Connector 300 is the four-polar jack including the fourcontacts of sleeve 304, ring 1_303, ring 2_302, and chip 301 arranged inthis order from a plug insertion port. The connector (360, 190) is thethree-pole plug including the three contacts of the chip (361, 191), thering (362), and the sleeve (363, 193) arranged in this order from a tip.When the connector (360, 190) that is the three-pole plug is insertedinto the connector (320) that is the three-polar jack, the microphone(1, 57) is coupled to headset main body 50.

Therefore, the bone conduction headset system can detect that PTT switch340 is pressed even when a transceiver coupled to connector 300 iseither of type A and type B.

Modification example 4 is a bone conduction headset system includingheadset main body 50 and bone conduction microphone 1. Headset main body50 includes PTT switch 340, the bone conduction speakers, connector 320coupled with bone conduction microphone 1, and connector 300 coupledwith transceiver 7. Connector 320 includes the three contacts of sleeve323, ring 322, and chip 321 arranged in this order. Connector 300includes the four contacts of sleeve 304, ring 1_303, ring 2_302, andchip 301 arranged in this order. Sleeve 304 of connector 320 is coupledto sleeve 323 of connector 300. Ring 322 of connector 320 is coupled tothe ground. Chip 321 of connector 320 is coupled to ring 2_302 ofconnector 300, as well as is coupled, via PTT switch 340, to the ground.The microphone device includes bone conduction microphone 1, connector360 configured to couple bone conduction microphone 1 to headset mainbody 50, and PTT switch 370. Connector 360 includes the three contactsof chip 361, ring 362, and sleeve 363 arranged in this order. Sleeve 363is coupled to a positive side terminal of bone conduction microphone 1.Chip 361 is coupled to a negative side terminal of bone conductionmicrophone 1. Ring 362 is coupled, via PTT switch 370, to the negativeside terminal of bone conduction microphone 1.

Therefore, the bone conduction headset system can detect that PTT switch340 is pressed even when a transceiver coupled to connector 300 iseither of type A and type B. Further, when bone conduction microphone 1is coupled to connector 300, PTT switch 370 of bone conductionmicrophone 1 can be used to make communications.

In the bone conduction headset system according to modification example4, the bone conduction speakers include left speaker 331 and rightspeaker 332. Ring 1_303 of connector 300 is coupled to one of leftspeaker 331 and right speaker 332. Chip 301 of connector 300 is coupledto the other of left speaker 331 and right speaker 332.

Therefore, the bone conduction headset system can output, from leftspeaker 331 and right speaker 332, sound entered through transceiver 7coupled to connector 300.

In the bone conduction headset system according to modification example4, when connector 300 is coupled to transceiver 7 that is a smartphonetype transceiver, ring 1_303 and ring 2_302 of connector 300 areshort-circuited. For example, a part configured to short-circuit ring1_303 and ring 2_302 may be inserted between connector 300 andtransceiver 7.

Therefore, ring 2_302 of connector 300 is short-circuited with ring1_303 of connector 300, and thus reaches the ground. Chip 321 ofconnector 320 also reaches the ground. In this case, chip 361 ofconnector 360 coupled to connector 320 also reaches the ground. As aresult, bone conduction microphone 1 attains a normally operating state.Chip 191 of connector 190 coupled to connector 320 also reaches theground. As a result, sound microphone 57 attains a normally operatingstate. Therefore, even when PTT switch 340 and PTT switch 370 are notpressed, communications are possible. As described above, the boneconduction headset system normally operates even when a transceivercoupled to connector 300 is a smartphone type transceiver.

Modification example 4 is headset main body 50 including PTT switch 340,the bone conduction speakers, connector 320 coupled with a microphone,and connector 300 coupled with transceiver 7. Connector 320 includes thethree contacts of sleeve 323, ring 322, and chip 321 arranged in thisorder. Connector 300 includes the four contacts of sleeve 304, ring1_303, ring 2_302, and chip 301 arranged in this order. Sleeve 304 ofconnector 320 is coupled to sleeve 323 of connector 300. Ring 322 ofconnector 320 is coupled to the ground. Chip 321 of connector 320 iscoupled to ring 2_302 of connector 300, as well as is coupled, via PTTswitch 340, to the ground.

Therefore, headset main body 50 can detect that PTT switch 340 ispressed even when a transceiver coupled to connector 300 is either typeA or type B.

In headset main body 50 according to modification example 4, connector320 is the three-polar jack including the three contacts of sleeve 323,ring 322, and chip 321 arranged in this order from a plug insertionport. Connector 300 is the four-polar jack including the four contactsof sleeve 304, ring 1_303, ring 2_302, and chip 301 arranged in thisorder from a plug insertion port.

Therefore, headset main body 50 can detect that PTT switch 340 ispressed even when a transceiver coupled to connector 300 is either typeA or type B.

In headset main body 50 according to modification example 4, the boneconduction speakers include left speaker 331 and right speaker 332. Ring1_303 of connector 300 is coupled to one of left speaker 331 and rightspeaker 332. Chip 301 of connector 300 is coupled to the other of leftspeaker 331 and right speaker 332.

Therefore, headset main body 50 can output, from left speaker 331 andright speaker 332, sound entered through transceiver 7 coupled toconnector 300.

In headset main body 50 according to modification example 4, whenconnector 300 is coupled with transceiver 7 that is a smartphone typetransceiver, ring 1_303 and ring 2_302 of connector 300 areshort-circuited. For example, a part configured to short-circuit ring1_303 and ring 2_302 may be inserted between connector 300 andtransceiver 7.

Therefore, ring 2_302 of connector 300 is short-circuited with ring1_303 of connector 300, and thus reaches the ground. Chip 321 ofconnector 320 also reaches the ground. In this case, chip 361 ofconnector 360 coupled to connector 320 also reaches the ground. As aresult, bone conduction microphone 1 attains a normally operating state.Chip 191 of connector 190 coupled to connector 320 also reaches theground. As a result, sound microphone 57 attains a normally operatingstate. Therefore, even when PTT switch 340 and PTT switch 370 are notpressed, conversations are possible. As described above, headset mainbody 50 normally operates even when a transceiver coupled to connector300 is a smartphone type transceiver.

Other Exemplary Embodiments

As described above, the exemplary embodiments and the modificationexamples have been described as examples of the technique in the presentdisclosure. For that purpose, the accompanying drawings and the detaileddescription have been provided.

The components illustrated in the accompanying drawings and described inthe detailed description can include components essential for solvingthe problems, as well as components that are not essential for solvingthe problems but required to describe the above techniques as anexample. For this reason, it should not be immediately recognized thatthose unnecessary components are necessary just because thoseunnecessary components are described in the accompanying drawings andthe detailed description.

The above exemplary embodiments and the modification examples areprovided to exemplify the technique according to the present disclosure,and various changes, replacements, additions, omissions, and the likecan be made within the scope of the claims and equivalents thereof.

For example, vocal cord sensor 11 is not limited to a piezoelectricelement, but may be a vibration detection element such as accelerationpickup gauge or differential transformer.

For example, contact member 12, housing 21, and cover 22 may not eachhave a cylindrical shape, but may each have a rectangular tubular shape.

For example, the second exemplary embodiment has illustrated an examplewhere, when bone conduction headset 5A is worn, central part 54 a ofsupport body 54 is arranged behind the head. However, the presentdisclosure is not limited to the example. Such a structure may beapplicable that central part 54 a is to be arranged on the head.

The second exemplary embodiment has illustrated an example where, whenbone conduction headset 5A is worn, support body 54 being formedbypasses the lower sides of the ears. However, the present disclosure isnot limited to the example. Such a structure may be applicable thatsupport body 54 has a shape extending along upper sides of the ears, andsupport body 54 can be hooked on the ears.

The second exemplary embodiment has illustrated an example where, whilemute switch 64 is pressed, volume of sound signals sent from transceiver7 lowers, whereas, when mute switch 64 is released, the volume of soundsignals sent from transceiver 7 returns to its original degree. However,the present disclosure is not limited to the configuration. Such aconfiguration may be applicable that, when mute switch 64 is pressedonce, volume lowers, and, when mute switch 64 is pressed again, thevolume returns to its original degree.

Modification example 4 to the exemplary embodiment has explained thatconnector 320 of headset main body 50 is a three-polar jack (female),whereas connector 300 is a four-pole plug (male). However, this ismerely an example. The present disclosure is not limited to the example.Such jacks and plugs may be applicable that conform to shapes ofconnector 190 of sound microphone 57, connector 360 of bone conductionmicrophone 1, and the connector of transceiver 7, which are to becoupled to headset main body 50. For example, connector 320 may be athree-pole plug, whereas connector 300 may be a four-polar jack.

INDUSTRIAL APPLICABILITY

The present disclosure is applicable to a bone conduction microphoneconfigured to come into contact with a human body and collect vocal cordvibration. The present disclosure is also applicable to a sound inputand output device used when a construction site helmet, a motorcyclehelmet, a headphone, or an intercommunication (in-com) device, forexample, is worn on the head to make communications with a communicationpartner.

REFERENCE MARKS IN THE DRAWINGS

-   1: bone conduction microphone (microphone)-   2: helmet-   3: chin strap-   4: microphone cable-   5, 5A: bone conduction headset-   6: headset cable-   7: transceiver-   9, 9A: communication device-   10: vibration collection unit-   11: vocal cord sensor-   12: contact member-   12 a: contact part-   12 b: side surface part-   12 c: opening part-   13: pressing member-   21: housing-   21 a: base-   21 b: pillar-   21 c: end face-   21 d: switch fixing part-   22: cover-   22 a: opening-   23: packing-   25: switch-   25 a: operation unit-   26: metal fixture-   30: diaphragm-   30 a: lower surface-   30 b: upper surface-   50: headset main body (sound input and output device)-   51: speaker (bone conduction speaker)-   52: ear hook-   54: support body-   54 a: central part-   54 b: end (first end)-   54 c: end (second end)-   54 b 1, 54 c 1: outside surface-   55: controller-   57: sound microphone (microphone)-   58: microphone holder-   59: coupler-   62, 230, 340, 370: PTT switch (communication switch)-   64: mute switch-   71: signal line-   72: sound line-   73: input unit-   190, 360: connector (third connector)-   300: connector (second connector)-   320: connector (first connector)-   P1: pressing force-   s1: stroke

The invention claimed is:
 1. A bone conduction microphone configured toconvert vocal cord vibration into a sound signal, the bone conductionmicrophone comprising: a vibration collection unit configured to comeinto contact with a human body and collect vibration in a predetermineddirection, the vibration being included in vocal cord vibration; and aswitch configured to switch whether collection of the vibration in thepredetermined direction is enabled, wherein the switch is disposed on aside of the vibration collection unit, the side being opposite to a sideconfigured to come into contact with the human body, to allow adirection of an operation of switching whether the collection of thevibration in the predetermined direction is enabled to be parallel tothe predetermined direction, the vibration collection unit includes: acontact member configured to come into contact with the human body; anda vocal cord sensor configured to detect vibration in the predetermineddirection via the contact member, the bone conduction microphone furtherincludes a housing configured to support at least a part of the contactmember and the switch, the contact member is an elastic body softer thanthe housing, the bone conduction microphone further includes a diaphragmpositioned between the vibration collection unit and the housing, thevibration collection unit is supported by the housing via the diaphragm,the housing has a tubular shape, the vibration collection unit issupported by the housing via the diaphragm to allow positiondisplacement to occur in an operation direction of the switch, and theswitch is disposed in the housing in a direction of positiondisplacement of the vibration collection unit, the switch beingconfigured to be turned on when position displacement occurs on thevibration collection unit, and when the vibration collection unitpresses the switch.
 2. The bone conduction microphone according to claim1, wherein the switch is configured to be turned on when the vibrationcollection unit is pressed onto the human body, and to be turned offwhen the vibration collection unit is detached from the human body, andthe vibration collection unit is configured to collect vibration in thepredetermined direction when the switch is in an on state, and not tocollect vibration in the predetermined direction when the switch is inan off state.
 3. The bone conduction microphone according to claim 1,wherein the diaphragm is an elastic body softer than the contact member.4. The bone conduction microphone according to claim 1, wherein thevibration collection unit and the switch are disposed in the housing toallow central axes extending in the direction of position displacementto align with each other.
 5. The bone conduction microphone according toclaim 1, wherein the vocal cord sensor is a piezoelectric elementconfigured to allow thickness vibration to occur, and a thicknessdirection of the piezoelectric element is identical to the predetermineddirection.
 6. A bone conduction headset comprising: the bone conductionmicrophone according to claim 1; and a speaker.
 7. A communicationdevice comprising: the bone conduction headset according to claim 6; anda transceiver configured to perform, when coupled to the bone conductionheadset, communications with an external device.
 8. A communicationdevice comprising: the bone conduction microphone according to claim 1;and a transceiver configured to perform, when coupled to the boneconduction microphone, communications with an external device.